Cleave Technology Sdn Bhd
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IN-HOUSE MACHINING CENTER
MACHINING FACILITIES INCLUDED CNC MILLING & LATHE MACHINE
MANUAL MILLING, TURNING AND GRINDING
SIZE UP TO 1000MM LENGTH
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SAWN WAFER INSPECTION SYSTEM
LEADFRAME INSPECTION SYSTEM
WAFER TRANSFER SYSTEM
REMOTE CONTROLLER KEYPAD FUNCTION CHECKER AND VISION SYSTEM
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